1775337-1 datasheet
Скачать datasheet 04023J0R3ABSTR.pdf Файл формата Pdf (20 страниц, 397,88 kb)
О ДАТАШИТЕ
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Маркировка1775337-1
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ПроизводительTE Connectivity
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ОписаниеTE Connectivity 1775337-1 Boss: With Centerline (mm [in]): 0.80 [0.031] Contact Base Material: Phosphor Bronze Contact Plating, Mating Area, Material: Gold Flash Ejector Location: None Ejector Type: Standard Housing Material: Thermoplastic - GF Insertion Style: Direct Insert Lead Free Solder Processes: Reflow solder capable to 245?°C, Reflow solder capable to 260?°C Module Orientation: Right Angle Mount Type: Printed Circuit Board Number Of Positions: 52 Number Of Rows: Dual Packaging Method: Tape & Reel Packaging Quantity: 600 Pcb Mount Style: Surface Mount Rohs/elv Compliance: RoHS compliant, ELV compliant Rohs/elv Compliance History: Always was RoHS compliant Row-to-row Spacing (mm [in]): 6.20 [0.244] Socket Style: Mini PCI Socket Type: Memory Card Stack Height (mm [in]): 5.20 [0.205]
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Количество страниц4 шт.
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Форматы файлаHTML, PDF
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